Transphorm and Weltrend Semiconductor announce new SuperGaN-based SiP family

Transphorm and Weltrend Semiconductor, a company specializing in USB power delivery (PD) controller integrated circuits (IC), have announced the release of two new GaN System-in-Packages (SiPs). The new devices, when paired with Weltrend’s leading GaN SiP introduced last year, create the initial SiP product line founded on Transphorm’s SuperGaN® platform.

The new System-in-Packages (SiPs), namely WT7162RHUG24B and WT7162RHUG24C, combine Weltrend’s high frequency multi-mode (QR/Valley Switching) Flyback PWM controller with Transphorm’s SuperGaN FETs, which have resistances of 150 mΩ and 480 mΩ respectively. The devices, similar to the 240 mΩ model (WT7162RHUG24A), can be used with USB PD or programmable power adapter controllers to offer a complete adapter solution.

Additionally, they include many cutting-edge functionalities such as the UHV valley tracking charge mode, adaptive OCP compensation, and adaptive green mode management, among others. These characteristics enable customers to efficiently develop top-notch power supplies in less time and with fewer components, utilizing a straightforward manner.

Weltrend highlights that Transphorm’s SuperGaN platform offers a comprehensive solution that combines design simplicity and exceptional performance. This platform is suitable for a wide range of devices, including low 30-watt USB-C PD power adapters and nearly 200-watt chargers.

04.18.2024

04.18.2024

04.18.2024

End product manufacturers are actively exploring ways to create new adapters that have a lower bill-of-materials (BOM), while still providing versatility, fast charging, and higher power outputs. In many cases, they aim to provide chargers that cater to a wide range of needs, offering multiple ports and various types of connections. All of this in a more compact and lightweight design.

Transphorm’s normally-off d-mode SuperGaN platform offers exceptional robustness with a gate margin of +/- 20 V and a noise immunity of 4 V. It also boasts impressive reliability with a FIT of less than 0.05, while increasing power density by 50% compared to silicon. Weltrend’s sophisticated SiP designs utilize its own cutting-edge technologies to create a seamless solution that streamlines design and minimizes the size of the form factor. Weltrend’s SuperGaN SiP family is designed to be used in high-performance, low-profile USB-C power adapters for a wide range of mobile and IoT devices, including smartphones, tablets, laptops, headphones, drones, speakers, cameras, and more.

Maurizio Di Paolo Emilio holds a Ph. D. in Physics and is a Telecommunications Engineer. He has worked on various international projects in the field of gravitational waves research, designing a thermal compensation system (TCS) and data acquisition and control systems, and on others about x-ray microbeams in collaboration with Columbia University, high voltage systems and space technologies for communications and motor control with ESA/INFN. TCS has been applied to the Virgo and LIGO experiments, which detected gravitational waves for the first time and earned the Nobel Prize in 2017. Since 2007, he has been a reviewer for scientific publications for academics such as Microelectronics Journal and IEEE journals. Moreover, he has collaborated with different electronic industry companies and several Italian and English blogs and magazines, such as Electronics World, Elektor, Mouser, Automazione Industriale, Electronic Design, All About Circuits, Fare Elettronica, Elettronica Oggi, and PCB Magazine, as a technical writer/editor, specializing in several topics of electronics and technology. From 2015 to 2018, he was the editor-in-chief of Firmware and Elettronica Open Source, which are technical blogs and magazines for the electronics industry. He participated in many conferences as a speaker of keynotes for different topics such as x-ray, space technologies, and power supplies. Maurizio enjoys writing and telling stories about Power Electronics, Wide Bandgap Semiconductors, Automotive, IoT, Embedded, Energy, and Quantum Computing. Maurizio has been an AspenCore content editor since 2019. He is currently editor-in-chief of Power Electronics News and EEWeb and a correspondent for EE Times. He is the host of PowerUP, a podcast about power electronics, and the promoter and organizer of the PowerUP Virtual Conference, a summit where each year great speakers talk about the power electronics design trends. Moreover, he has contributed to a number of technical and scientific articles as well as a couple of Springer books on energy harvesting and data acquisition and control systems.