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SEPA Europe GmbH has unveiled the HZ30B chip cooler, which addresses the growing need for cooling in embedded computing. The device’s lightweight nature, flat structure, and convenient mounting adhere to established criteria while maintaining optimal cooling capabilities.
The HZ30B active cooler presents a novel approach by incorporating the high-performance MF17B05 RaAxial fan within an aluminum pinbloc heat sink, as opposed to using it as a surface-mounted component. This particular design facilitates a significantly reduced total height of merely 8 mm, hence allowing the chip cooler to occupy ample space even within the smallest device. Furthermore, the cooling capacity is evident due to the offset pins, which enhance the effectiveness of airflow. Additionally, the thermal resistance of 4.7 K/W is noteworthy.
The active cooler establishes benchmarks even in terms of weight. With a weight of a mere 11 g, this device is well-suited for systems that prioritize efficiency and noise reduction. In a setting where the importance of low-noise operation is substantial, it is strongly advised.
Mounting the chip cooler without drilling is a straightforward and efficient process. The utilization of SEPA EUROPE’s thermally conductive adhesive foil TCT is highly recommended. This foil exhibits efficient heat conductivity, hence enhancing the cooling efficiency.
The MF17B05 integrated small fan is fitted with a MagFix® sleeve bearing, which is specifically engineered to withstand operating temperatures of up to 80°C. The device is powered by a 5 VDC voltage and has a power consumption of only 0.3 W. The lifespan of the object is 400,000 hours. If deemed essential, the fan may additionally be outfitted with a tacho output to facilitate the monitoring of its operation. The fan and heat sink can be purchased individually.
The post SEPA Europe announces the HZ30B chip cooler, providing high cooling capacity with minimum overall height appeared first on Power Electronics News.
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