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Efficient Power Conversion (EPC) has recently released its Phase-16 Reliability Report, which provides a comprehensive account of ongoing research conducted through the test-to-fail technique. This report includes detailed recommendations for overvoltage standards and enhancements to thermo-mechanical reliability.
In contrast to the Phase 15 Reliability Report, the present iteration offers a more comprehensive compilation of data and analysis. The current version covers a comprehensive examination of the wear-out mechanisms that are of main significance in a specific application. This version of the study includes a detailed explanation of how to predict the dependability of a system in a practical mission scenario that includes both significant and small stress periods.
Adding to the existing knowledge base, this report includes significant new material on the thermo-mechanical wear-out mechanisms and overvoltage guidelines. Thermo-mechanical wear-out mechanisms include a study of the impact of die size and bump shape on temperature cycling (TC) reliability. This report also includes a study of overvoltage robustness for both the gate and the drain of GaN transistors.
This report is divided into the following sections:
- Section 1: Determining wear-out mechanisms using test-to-fail methodology.
- Section 2: Using test-to-fail results to predict device lifetime in a system.
- Section 3: Wear-out mechanisms
- Section 4: Mission-specific reliability predictions including solar, DC-DC, and lidar applications.
- Section 5: Summary and conclusions
- Appendix: Solder stencil design rules for reliable assembly of PQFN packaged devices
Dr. Alex Lidow, the CEO and co-founder of EPC, asserts that the publication of the Phase-16 report addresses a crucial requirement for continuous investigation into the reliability of GaN devices. This paper offers significant insights into the robustness of missions, ensuring that devices are capable of meeting the requirements of a wide range of applications.
The post EPC releases Phase-16 Reliability Report adding new findings about GaN reliability appeared first on Power Electronics News.
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